MC-1770TI : 1.77″ Square Tyvek Wafer Separator for IC Chip and Bare Die Tray

Detailed Product Description:

The Waffle Pack Separator MC-1770TI is a cutting-edge solution specifically designed for use in waffle pack trays, IC chip trays, and CPS trays. This separator is crafted from high-quality Tyvek material and measures 1.77″ x 1.77″, making it an ideal fit for 2-inch waffle trays used in semiconductor and electronics industries.

This separator ensures optimal protection of bare dies, IC chips, and other sensitive components during transportation and storage. Tyvek is known for its exceptional combination of strength, flexibility, and lightweight properties, making it a superior choice for high-tech applications that demand both mechanical durability and electrostatic discharge (ESD) protection.

 

Key Features and Benefits:

• Convenient Packaging: Packaged in quantities of 250 units, ensuring you have the right amount for efficient production workflows.
• Precision Fit: The 1.77″ x 1.77″ size ensures a snug fit in standard 2″ waffle pack trays, covering all cavities to provide complete protection.  If you need a different size, we offer customizable solutions to meet your specific tray requirements.
• Electrostatic Discharge Protection: The Waffle Pack Separator MC-1770TI is designed with antistatic properties, preventing harmful ESD events that can damage sensitive electronics.
• Contamination Control: Tyvek’s smooth surface minimizes particulate shedding, ensuring contamination-free handling of components and preventing Foreign Object Debris (FOD) in critical environments.
• Durable Construction: Built for repeated use, this separator provides long-term protection without breaking down or compromising performance.

 

Practical Applications:

The Waffle Pack Separator MC-1770TI is ideal for use in industries that demand precise handling of small, delicate components:

1. Semiconductor Manufacturing: Protects bare dies and IC chips during the critical stages of manufacturing, transportation, and storage.
2. Electronics Production: Shields circuit boards, microchips, and other electronic components from ESD and contamination.
3. Waffle Pack Trays: Specifically designed for waffle pack and CPS trays, ensuring that each cavity remains secure and protected.
4. Cleanroom Use: Suitable for cleanroom environments where cleanliness and static control are essential.

 

Advantages Over Other Packaging Solutions:

When compared to traditional packaging materials such as plastic, paper, or foam, the Waffle Pack Separator MC-1770TI offers several key advantages:

• Better ESD Protection: Tyvek offers superior protection against electrostatic discharge compared to plastic and foam, which are prone to static buildup.
• Lower Contamination Risk: Unlike foam or paper, Tyvek is virtually lint-free and does not shed particles, making it ideal for contamination-sensitive environments.
• Durability: Foam and paper can easily tear or degrade, but Tyvek’s continuous fiber structure ensures that the separator maintains its integrity over long-term use.
• Custom Fit: Designed to fit perfectly in waffle packs, providing better protection than generic materials.

 

Why Use Malaster Products:

Malaster’s Waffle Pack Separator MC-1770TI is more than just a protective barrier. It is the result of decades of experience in the semiconductor and electronics industries. We understand the importance of clean, safe handling for sensitive components, which is why our separators are engineered for optimal ESD protection, durability, and contamination control. When you choose Malaster, you are choosing industry-leading expertise and unparalleled product quality.

 

Environmental and Economic Benefits:

The Waffle Pack Separator MC-1770TI is not only a superior protective solution but also an environmentally conscious choice:

• Recyclable: Made from high-density polyethylene (HDPE), Tyvek is fully recyclable, reducing waste and contributing to sustainability.
• Reusable: Designed for repeated use, the separator reduces the need for single-use protective materials, cutting down on packaging waste and costs over time.
• Lower Total Cost of Ownership: With its durability and reusability, the Waffle Pack Separator MC-1770TI offers a cost-effective solution that provides long-lasting protection, reducing the need for frequent replacements.

 

Industry Compliance and Quality Assurance:

The Waffle Pack Separator MC-1770TI meets or exceeds the highest industry standards, ensuring safe and reliable use in critical applications:

• RoHS Compliance: Free from hazardous substances, making it ideal for use in electronic applications.
• REACH Compliance: Tyvek is free from substances of very high concern (SVHC), ensuring safety and environmental compliance in global markets.
• Antistatic Performance: Tested and proven to meet EIA STD 541 standards, the separator offers rapid static dissipation and ensures that static buildup does not cause contamination or damage to sensitive electronic components.

Malaster’s commitment to quality is reflected in our products, with a rigorous internal quality management system aligned with ISO standards.

 

Conclusion:

In conclusion, the Waffle Pack Separator MC-1770TI is the perfect solution for ensuring the safety and integrity of sensitive components such as bare dies and IC chips. Whether you are working in semiconductor manufacturing, electronics production, or cleanroom environments, this separator provides the ESD protection and contamination control you need. With its precise 1.77″ x 1.77″ fit, recyclable material, and robust durability, the Waffle Pack Separator MC-1770TI is a reliable choice for those seeking the best protection for their high-value components.

Explore the Waffle Pack Separator MC-1770TI today and experience why Malaster is trusted by industry leaders around the world for superior component protection.